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Product Model: SPI-6500

Application: solder paste. Red plastic. BGA.FPC.CSP

Measurement item: thickness. Area. Volume .3D shape. Plane distance

Measurement principle: laser 3 angle function measurement automatically calculate and display PCB deformation or tilt angle

Language: Chinese / English

Illumination light source: white highlight LED

Measuring light source: Red laser module

Y-axis movement range: 50 mm

Measurement method: automatic full-screen measurement. Frame selected automatic measurement. Frame selected manual measurement

Field of view: 12mm * 15mm

Camera pixels: 3 million / field of view

Highest resolution: 0.1um

Scanning spacing: 5 um / 10 um / 15 um / 20 um

Repeat the measurement accuracy: height less than plus or minus 1um, area <1%, volume <1%

Magnification: 50X

Maximum measurable height: 5 mm

Maximum measurement speed: 250Profiles / s

3D mode: face. Line. Point 3 different 3D simulation, scalable

SPC software: production line information, printed materials, solder paste data, steel mesh data, measurement results were independently analyzed, X-Bar & R diagram analysis, histogram analysis & Ca / Cp / Cpk output, Sigma automatic judgment

Operating system: Windows7

Computer system: dual-core P4, 2G memory, 20-inch LCD

Power supply: 220V 50 / 60Hz

Maximum power consumption: 300W

Weight: about 35KG


Southern Import And Export Trading Co., Limited
Add:A Building ,Tianyou Industiral Park,Fuyong Town,Ban'an,Shenzhen,China