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3D Hybrid Modular S20
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Board size(with buffer unused) Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455)

Board size(with input or output buffer used) -

Board size(with input and output buffers used) Min. L50 x W30mm to Max. L540 x W510mm

Board thickness 0.4 - 4.8mm

Board flow direction Left to right (Standard)

Board transfer speed Max 900mm/sec

Placement speed (12 heads + 2 theta) Opt. Cond. 0.08sec/CHIP (45,000CPH)

Placement accuracy A (μ+3σ) CHIP +/-0.040mm

Placement accuracy B (μ+3σ) IC +/-0.025mm

Placement angle +/-180 degrees

Z axis control / Theta axis control AC servo motor

Component height Max 30mm*1 (Pre-placed components: max 25mm)

Applicable components 0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)

Component package 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray

Drawback check Vacuum check and vision check

Screen language English, Chinese, Korean, Japanese

Board positioning Board grip unit, front reference, auto conveyor width adjustment

Component types Max 180 types (8mm tape), 45 lanes x 4

Transfer height 900 +/- 20mm

 

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